製程能力
process capability
capability
| item | standard | advanced | |
| max. layer counts | 52 | 70 | |
| max. board thickness | 6.35mm | 7.0mm | |
| min. core thickness | 0.075mm | 0.05mm | |
| max. board size | 560mm*711mm | 560mm*711mm | |
| trace & space | inner | 50 / 60um | 50 / 50um |
| outer | 75 / 75um | 60 / 75um | |
| min. drilled size | 0.15mm | 0.1mm (board thickness≦1.6mm) | |
| 縱橫比 aspect ratio | ~33.3 | ~42.3 | |
| drill to copper 鑽孔距銅箔 | dut area | 0.125mm | 0.1 mm |
| other area | 0.15 mm | 0.125 mm | |
| routing tolerance | /- 0.125mm | /- 0.1mm | |
| solder mask dam下墨間距 | 0.1mm min. | 0. 075mm min. | |
| blind mechanical vias盲孔機鑽 | 0.15mm | 0.15mm | |
| buried mechanical vias埋孔機鑽 | 0.15mm | 0.15mm | |
| mechanical depth drills vias 盲深度控制 | /- 0.125mm | /- 0.1mm | |
| 銅厚 copper weights | min. outer | 1/2 oz | 1/3 oz |
| min. inner | 1/2 oz | 1/3 oz | |
| max. outer | 3 oz | 6 oz | |
| max. inner | 3 oz | 6 oz | |
| via on pad 製程 | yes | yes | |
| impedance control | inner | /- 8~10% | /- 5~10% |
| outer | /- 10% | /- 5~10% | |
| item | standard | advanced | |
| max. layer counts | 52 | 70 | |
| max. board thickness | 6.35mm | 7.0mm | |
| min. core thickness | 0.075mm | 0.05mm | |
| max. board size | 560mm*711mm | 560mm*711mm | |
| trace & space | inner | 50 / 60um | 50 / 50um |
| outer | 75 / 75um | 60 / 75um | |
| min. drilled size | 0.15mm | 0.1mm (board thickness≦1.6mm) | |
| 縱橫比 aspect ratio | ~33.3 | ~42.3 | |
| drill to copper 鑽孔距銅箔 | dut area | 0.125mm | 0.1 mm |
| other area | 0.15 mm | 0.125 mm | |
| routing tolerance | /- 0.125mm | /- 0.1mm | |
| solder mask dam下墨間距 | 0.1mm min. | 0. 075mm min. | |
| blind mechanical vias盲孔機鑽 | 0.15mm | 0.15mm | |
| buried mechanical vias埋孔機鑽 | 0.15mm | 0.15mm | |
| laser drilled micro vias雷鑽 | 0.1mm | 0.05mm | |
| mechanical depth drills vias 盲深度控制 | /- 0.125mm | /- 0.1mm | |
| 銅厚 copper weights | min. outer | 1/2 oz | 1/3 oz |
| min. inner | 1/2 oz | 1/3 oz | |
| max. outer | 3 oz | 6 oz | |
| max. inner | 3 oz | 6 oz | |
| via on pad 製程 | yes | yes | |
| impedance control | inner | /- 8~10% | /- 5~10% |
| outer | /- 10% | /- 5~10% | |
| hdi 多層次疊合製程 | 1 n 1, 2 n 2, 3 n 3 | any layer | |
drill /plating 制程能力
通孔电镀能力
| pitch | 板厚 | 孔徑 | 縱橫比 | 最小孔銅厚度 | 最大孔銅厚度 |
| 0.35mm | 5.0mm | 0.125mm | 40 | 0.4mil | 0.6mil |
| 0.4mm | 6.35mm | 0.15mm | 42.3 | 0.4mil | 1.0mil |
| 0.5mm | 6.35mm | 0.2mm | 31.8 | 0.4mil | 1.0mil |
| pitch | 板厚 | 孔徑 | 縱橫比 | 最小孔銅厚度 | 最大孔銅厚度 |
| 0.35mm | 5.0mm | 0.125mm | 40 | 0.4mil | 0.6mil |
| 0.4mm | 6.35mm | 0.15mm | 42.3 | 0.4mil | 1.0mil |
| 0.5mm | 6.35mm | 0.2mm | 31.8 | 0.4mil | 1.0mil |
背钻能力
| 標準 | 高級 | |
| a : drill size | ||
| b : back drill | a 8 mil min. | a 4 mil min. |
| c : clearance | a 16 mil min. | a 8 mil min. |
| d : stub(殘留) | 16 mil max. | 12 mil max. |
| 標準 | 高級 | |
| a : drill size | ||
| b : back drill | a 8 mil min. | a 4 mil min. |
| c : clearance | a 16 mil min. | a 8 mil min. |
| d : stub(殘留) | 16 mil max. | 12 mil max. |
fine pitch pcb technology
 | |
| unit : mm | |
pitch 0.35mm | |
| drill | 0.15 |
| board thickness | 5.0 |
| pad | 0.25 |
| trace width | 0.04 |
| clearance | 0.08 |
pitch 0.4mm | |
| drill | 0.15 |
| board thickness | 5.0 |
| pad | 0.3 |
| trace width | 0.05 |
| clearance | 0.1 |
pitch 0.5mm | |
| drill | 0.2mm |
| board thickness | 6.35 |
| pad | 0.35 |
| trace width | 0.05 |
| clearance | 0.125 |
| unit : mm | |
|
pitch 0.35mm |
|
| drill | 0.15 |
| board thickness | 5.0 |
| pad | 0.25 |
| trace width | 0.04 |
| clearance | 0.08 |
|
pitch 0.4mm |
|
| drill | 0.15 |
| board thickness | 5.0 |
| pad | 0.3 |
| trace width | 0.05 |
| clearance | 0.1 |
|
pitch 0.5mm |
|
| drill | 0.2mm |
| board thickness | 6.35 |
| pad | 0.35 |
| trace width | 0.05 |
| clearance | 0.125 |